DigiTimes reported today that smartphone players such as Apple, Samsung Electronics and High Tech Computer (HTC) have started showing interest in adopting ultra-thin heat pipes for their smartphones and are expected to release heat pipe-adopted models in the fourth quarter, at the earliest, according to sources from cooling module player. Yet like so many times, Apple has been known to buck some of the industry's traditional trends. The most recent is Apple's AirDrop solution coming to iOS 7 which blatantly bucks the trend of using NFC technology that the likes of Samsung use in their Galaxy product line-up. Apple's Craig Federighi got quite the laugh making fun of Samsung's solution of physically having to tap smartphones in order to transfer photos or data to those in close proximity to you. So while the industry may be moving toward adopting ultra-thin heat pipes, it doesn't necessarily guarantee that Apple will follow.